The Effect of Zinc Addition on the Characteristics of Sn–2.0Ag–0.7Cu Lead-Free Solders

&
In Rizauddin Saian & Mohd Azwan Abbas, Proceedings of the Second International Conference on the Future of Asean (Icofa) 2017 – Volume 2: Science and Technology. Springer Singapore. pp. 767-775 (2018)
  Copy   BIBTEX

Abstract

Sn–Pb solder was a popular solder in electronics industry. Due to the negative effects from the usage of that solder, researchers start to find a replacement for the Sn–Pb solder. The new solder should maintain the same or better properties than the Sn–Pb solder. In this study, a newly developed solder which is Sn–2.0Ag–0.7Cu with the addition of 0.5, 1.0, 1.5, and 3.0 wt% of Zn was studied. These solders were prepared via powder methodology method and several characterizations were done on them. The 1.0 wt% Zn solder shows the lowest melting point of 222.30 °C and the 0 wt% Zn shows the highest value of 225.65 °C. The 1.0 wt% Zn solder shows the lowest Cu6Sn5 intermetallic thickness value of 1.58 µm and reasonable joint strength. The presence of 1.0 wt% Zn in the Sn–2.0Ag–0.7Cu solder improves the solder properties.

Categories

Add categories

Keywords

Reprint years

DOI

10.1007/978-981-10-8471-3_75

Other Versions

No versions found

Links

PhilArchive

    This entry is not archived by us. If you are the author and have permission from the publisher, we recommend that you archive it. Many publishers automatically grant permission to authors to archive pre-prints. By uploading a copy of your work, you will enable us to better index it, making it easier to find.

    Upload a copy of this work     Papers currently archived: 104,292

External links

Setup an account with your affiliations in order to access resources via your University's proxy server

Through your library

My notes

Similar books and articles

High-resolution electron microscopy observations of the microstructure of a rapidly solidified Mg–9.0 wt% Al–1.0 wt% Zn–4.0 wt% Sn alloy. [REVIEW]D. Zhao, Y. Liu, X. Nie, J. Zhou, J. Wang, Y. Shen, S. Zhu & S. Guan - 2011 - Philosophical Magazine 91 (19-21):2654-2660.
Cyclic deformation and fatigue cracking behaviour of polycrystalline Cu, Cu–10 wt% Zn and Cu–32 wt% Zn.P. Zhang, Q. Q. Duan, S. X. Li & Z. F. Zhang - 2008 - Philosophical Magazine 88 (16):2487-2503.
Correlation between resistivity increment and volume fraction of G.P. zones in an Al-3·2 wt % Zn-2·2 wt % Mg alloy.J. Lendvai, T. Ungár, I. Kovács & G. Groma - 1976 - Philosophical Magazine 33 (1):209-212.
Deformation twinning in Zn, Sn and Bi single crystal whiskers.D. R. Overcash, E. P. Stillwell, M. J. Skove & J. H. Davis - 1972 - Philosophical Magazine 25 (6):1481-1488.
Multi-temperature equal channel angular pressing of Mg-3 wt%Al-1 wt%Zn alloy.Peter Molnár & Aleš Jäger - 2013 - Philosophical Magazine 93 (27):3612-3626.
Adding Sn on the Performance of Amorphous Brazing Fillers Applied to Brazing TA2 and Q235.Jie Cui - 2014 - JSEMAT 4:342-347.
Thermophysical properties of Cu–In–Sn liquid Pb-free alloys: viscosity and surface tension.Ali Dogan & Hüseyin Arslan - 2018 - Philosophical Magazine 98 (1):37-53.
The effect of matrix on melting and solidification behaviours of embedded Pb-Sn alloy nanoparticles.Patan Yousaf Khan & Krishanu Biswas - 2014 - Philosophical Magazine 94 (18):2031-2045.
Mechanical Properties and X-Ray Diffraction of Oil Palm Empty Fruit Bunch All-Nanocellulose Composite Films.Nur Liyana Izyan Zailuddin, Azlin Fazlina Osman, Salmah Husseinsyah, Zailuddin Ariffin & Faridah Hanum Badrun - 2018 - Proceedings of the Second International Conference on the Future of Asean (Icofa) 2017 – Volume 2: Science and Technology:505-514.
Heavy metals phyto-assessment in commonly grown vegetables: water spinach (I. aquatica) and okra (A. esculentus).Chuck Chuan Ng - 2016 - Springerplus 1 (5):469.

Analytics

Added to PP
2023-03-12

Downloads
8 (#1,639,474)

6 months
3 (#1,159,250)

Historical graph of downloads
How can I increase my downloads?

Citations of this work

No citations found.

Add more citations

References found in this work

No references found.

Add more references